hong kong: Taiwan Semiconductor Manufacturing Co (TSMC) announced on Tuesday that it will soon produce an ultra-advanced 3-nanometer (nm) chip, as the major contract chipmaker grapples with supply chain and manufacturing issues. other constraints.
According to the South China Morning Post, TSMC CEO CC Wei acknowledged that the company is facing delivery delays as part of a global expansion.
“When car companies told me they were running out of semiconductors, I thought, ‘How come these guys don’t understand the importance of chips?’ But later, TSMC’s own equipment suppliers encountered delivery problems and told me that it was also due to a shortage of components and chips,” Wei said at an annual technology forum in China. .
“I think the whole world didn’t realize how important supply chain management was in the past, and the whole world didn’t do a good job on supply chain management , including TSMC,” Wei said.
TSMC is also aiming for its 3D chip stacking technology, known as SOIC, to enter mass production this year.
Apple and Intel will be the first companies to use TSMC’s 3nm chips.
Last month, Samsung marked the first shipment of 3-nanometer semiconductors at a ceremony, a key milestone in the race to build the most advanced and efficient chips yet.
The next-generation 3nm chips are built on Gate-All-Around (GAA) technology, which Samsung says will eventually enable up to 35% area reduction, while delivering 30% better performance and energy consumption reduced by 50%. compared to the existing FinFET process.
TSMC, the world’s largest contract chipmaker, said it would begin mass production of 3nm chips in the second half.
Samsung, the world’s largest memory chipmaker and the second-largest foundry player, said its 2nm process node is in the early stages of development, with mass production planned for 2025.