DENSO and USJC Collaborate on 300mm IGBT Production



A line of insulated-gate bipolar transistors (IGBTs) will be installed at USJC’s wafer fabrication facility, which will be the first in Japan to produce IGBTs on 300mm wafers. DENSO will contribute its system-oriented IGBT device and process technologies while USJC will provide its 300mm wafer fabrication capabilities to bring the 300mm IGBT process into mass production – currently scheduled for the first half of 2023.

“DENSO is very pleased to be the member of the first companies in Japan to start mass production of IGBTs on 300mm wafers,” said Koji Arima, President of DENSO in a press release. “Semiconductors are becoming increasingly important in the automotive industry as mobility technologies evolve, including automated driving and electrification. Through this collaboration, we are contributing to the stable supply of semi- power conductors and automobile electrification.

“As a key foundry player in Japan, USJC is committed to supporting the government’s strategy to boost domestic semiconductor production and the transition to more environmentally friendly electric vehicles,” adds Michiari Kawano, president of the USJC. “We are confident that our automotive customer-certified foundry services combined with DENSO’s expertise will produce high-quality products to propel tomorrow’s automotive trends.”

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